• 专利附录
  • 专利说明
  • 权利要求
  • 类似技术
  • 同族专利
  • 引用文献
  • 法律状态
  • 优先权
    • 专利摘要:
    method for controlling a laser cutting process and laser cutting system implemented the same according to the invention, a laser cutting process is controlled using as reference signal one or more emission lines, which are characteristic of the emitted radiation by a gas (be it an auxiliary gas or a contaminating gas) or more generally, by an emitting element present in the volume irradiated by the laser beam focused by a laser head (12) and adjusting, based on this reference signal, at least one of the following process control parameters: the laser power, the frequency and the duty cycle of the laser pulse, the pressure of an auxiliary gas emitted by an injector (16) that is part of the laser head (12 ), the relative speed of the laser head (12) with respect to the workpiece (p), the distance between the laser head (12) and the surface (s) of the workpiece (p), and the distance between the focal point (f) of the laser beam and the surface (s) of the workpiece work (p).
    公开号:BR112013027102B1
    申请号:R112013027102-7
    申请日:2012-04-20
    公开日:2021-04-06
    发明作者:Maurizio Sbetti；Stefano Bertoldi；Daniele Colombo；Barbara Previtali；Giovanni Riva；Matteo Danesi；Lorenzo Molinari Tosatti；Diego Parazzoli
    申请人:Adige S.P.A；
    IPC主号:
    专利说明:

    [0001] [001] The present invention relates in general to the field of laser cutting processes, and more precisely, to a method for controlling a laser cutting process, as well as a laser cutting system implemented such method. Fundamentals of the Invention
    [0002] a) o calor fornecido pelo feixe de laser focado; e b) o calor fornecido por uma reação química causada por um assim chamado gás auxiliar, uma vez que tal reação é uma reação exoenergética (tipicamente uma reação de combustão, ou mais geralmente uma reação envolvendo a combinação do gás auxiliar com o material da peça de trabalho). [002] The term "laser cutting process" refers, for the purposes of the present invention, to a process in which a laser beam focused on or near the surface of a workpiece produces a transformation of the material of the workpiece hit by the laser beam to obtain a through hole first and then a cutting line starting from that through hole. The relative movement of the laser beam with respect to the workpiece determines the total area, or volume, of the material involved in the process. Typically, the material transformation due to the process is either a mechanical type transformation (deformation) or a physical type transformation (phase transition by melting, evaporation or sublimation) and is due to the following two main factors, combined in varying proportions: a) the heat provided by the focused laser beam; and b) the heat provided by a chemical reaction caused by a so-called auxiliary gas, since such a reaction is an exoenergetic reaction (typically a combustion reaction, or more generally a reaction involving the combination of the auxiliary gas with the material of the workpiece) work).
    [0003] [003] In the event that the heat supply indicated above by (b) is not supplied, the auxiliary gas is an inert gas (such as, for example, N2, Ar or He) and has the function of protection or propulsion mechanical (that is, it serves to blow the material that has melted, evaporated, or sublimated as a result of the heat provided by the laser beam).
    [0004] [004] Conversely, in the case where the heat supply indicated above by (b) is greater than or equal to 40% of the total energy supply, the auxiliary gas is a reactive gas and acts as an energy producing device or as an oxidizer. The function of the auxiliary gas in the laser working process is, therefore, in the case of producing energy for the process by means of an exoenergetic reaction, with two simultaneous effects in the process: 1) increase in the temperature of the volume of material involved, which results in a physical change of state due to the thermal effect (plasticization, fusion, evaporation or sublimation); and 2) self-sustaining of the reaction, due to the fact that the temperature of the volume of material involved and the available thermal energy ensure the conditions required to cause and sustain the exoenergetic reaction. An example of a reactive auxiliary gas is oxygen (O2), which is used in laser cutting operations carried out on carbon steel alloys, since it is capable of sustaining an oxidation reaction of the iron contained in the steel.
    [0005] [005] Laser drilling as a preliminary cutting phase is generally performed without relative movement of the laser beam with respect to the workpiece and aims to cause the material wall to break in view of the subsequent cutting process. Laser drilling is performed with an optical configuration and with a position of the focal point in relation to the material that must also be compatible with the cutting process that takes place immediately after the material wall has been broken. Laser drilling takes place in a volume that remains closed until the end of the process. As schematically illustrated in FIG. 1 of the attached drawings, the laser drilling process first involves the surface S of the workpiece P, then involves creating a cylinder that comprises, starting from the optical axis A of the laser beam, a space that collects evaporated / sublimated material, molten and heated, in an atmosphere comprising the auxiliary gas, possible by-products derived from chemical reactions between the workpiece material and the co-present gases, as well as possible other gases contained in the air in which the processed workpiece is placed, gases that are present as contaminants.
    [0006] [006] Unlike the perforation, the laser cutting process provides a relative movement of the focused laser beam with respect to the workpiece. Furthermore, as schematically shown in FIG. 2 of the attached drawings, the laser cutting process takes place in an open volume defined by three surfaces, that is, by a pair of flat surfaces S1, S2 that extend parallel to the direction of the relative movement of the focused laser beam with respect to to the workpiece, and a third surface S3 that connects the first two surfaces and represents the leading edge of the cut. As schematically shown in FIG. 3 of the attached drawings, which is a section view of a material wall being cut by means of a laser, a view that is obtained through a section plane parallel to the direction of the section, the front edge of the section is formed by several layers of heated, molten and evaporated / sublimated material, in an atmosphere that comprises the auxiliary gas, possible by-products derived from chemical reactions between the material of the workpiece being processed and the gases present, as well as possible other gases contained in the air in which the workpiece is placed, gases that are present as contaminants.
    [0007] [007] The US Patent. 5,373,135 describes a method for controlling a laser cutting process based on the setting of two temperature limits, that is, a minimum temperature limit and a maximum temperature limit, respectively, corresponding to the melting temperature of the material being processed and at a temperature between the melting temperature and the evaporation temperature of the material being processed, and in measuring the temperature by measuring the light intensity. When the measured temperature is greater than the predetermined maximum limit, then the laser is turned off, and when the measured temperature is lower than the predetermined minimum limit, then the laser is turned on. The control parameter of this known method is then the temperature. Summary of the Invention
    [0008] [008] That being said, it is an objective of the present invention to provide a method for controlling a laser cutting process of the type identified above, regardless of whether the process is performed with a reactive gas or with an inert gas, with a laser CO2 or with a solid state laser (Nd: YAG, fiber laser, disk laser, diode laser), a method that minimizes the risk that the process will get out of control and enter a paroxysmal state of a process using a reactive gas as an auxiliary gas, allows to minimize the risk of closing the incision, and then the risk of interrupting the process, and also allows to improve the quality of the final result of the process compared to one obtained with the control methods already used to control the laser cutting process.
    [0009] [009] This objective is completely achieved in accordance with the present invention by virtue of a method for controlling a laser cutting process comprising the steps presented in independent claim 1.
    [0010] [010] In accordance with a further aspect of the present invention, this objective is completely achieved by virtue of a laser cutting system having the characteristics shown in independent claim 4.
    [0011] [011] The advantageous ways of implementing the control method according to the invention and the advantageous modalities of the laser cutting system according to the invention are the subject of the dependent claims, the content of which is considered an integral and integral part of the following description.
    [0012] [012] In summary, the invention is based on the idea of controlling the laser cutting process, including the initial drilling phase, using as a reference signal one or more emission lines specific to the radiation emitted by a gas (be it an auxiliary gas or a contaminating gas) present in the volume involved by the irradiation of the focused laser beam and adjusting, based on this reference signal, at least one of the following process control parameters: laser power, frequency and cycle working time of the laser pulse, the pressure of an auxiliary gas, the relative speed of the laser with respect to the workpiece, the distance between the laser head and the workpiece surface, and the distance between the beam focal point laser and the workpiece surface.
    [0013] - a radiação vinda do volume envolvido pelo processo a laser é detectada por meios sensores operando em uma banda centralizada em um comprimento de onda previamente escolhido no mais adequado para controlar o processo; - o sinal assim detectado é adequadamente filtrado e processado e então enviado como entrada para uma unidade eletrônica de controle; e - a unidade eletrônica de controle interpreta o sinal recebido como entrada e, se necessário, muda um dos parâmetros de controle do processo indicados acima. [013] The control method according to the invention then implements a control loop comprising the following steps: - the radiation coming from the volume involved by the laser process is detected by sensor means operating in a centralized band at a wavelength previously chosen in the most appropriate to control the process; - the signal thus detected is properly filtered and processed and then sent as an input to an electronic control unit; and - the electronic control unit interprets the received signal as an input and, if necessary, changes one of the process control parameters indicated above.
    [0014] [014] The emission lines specific to the radiation that is monitored for the purpose of controlling the process (hereinafter called the control radiation) are detected with a bandwidth that is not greater than 100 nm.
    [0015] [015] Preferably, oxygen or nitrogen is used as the emission gas. The gas used as the emission gas can be either an auxiliary gas or a contaminant gas. In this second case, the gas can be either a gas normally present in the atmosphere around the workpiece being processed or a gas expressly introduced for that purpose in the volume involved by the laser process.
    [0016] [016] If the gas has a mainly reactive function, its emissions can be interpreted as indicative of the level of intensity with which the reaction process is taking place: a very low level means that the reaction process is not taking place at the rate that would be possible, since a very high level means that the reaction process is occurring at an excessive rate, therefore, with the risk of an uncontrolled or explosive process situation. In the case of a pulsed laser, the derivative of the signal or the minimum level reached by a laser exchanged before the subsequent pulse can obtain an indication that the process will tend to reduce or increase its intensity, thus becoming, on the one hand, ineffective and, on the other hand, out of control or explosive. The same information can also be obtained in the case of a continuous laser, introducing an overemodulation in the laser power and comparing the time derivatives of the signal emitted by the gas during the submodulation stage and during the overemodulation stage. Another type of control can be obtained by comparing the levels of radiation emission at two or more different wavelengths, which indicate the presence or transformation of at least two chemical species or compounds within the volume involved by the laser cutting process .
    [0017] [017] If the gas has the function of a contaminant, whether it is normally present in the atmosphere around the workpiece being processed or expressly introduced into the process for that purpose, its emissions can be interpreted as a control signal even in the case of a process laser cutting using an inert gas as an auxiliary gas. In the case of laser drilling performed in preparation for cutting, the signal emitted by the contaminating gas provides information that the drilling cylinder is still closed and that the process is not yet terminal. Once the opening in the material has been formed, the control signal decreases significantly and shows that the process has ended. In the case of laser cutting, an increase in the signal emitted by the contaminating gas provides information that the leading edge of the cut is tending to become parallel to the surface of the workpiece being processed, thus expelling less material, less by-products and less gas. contaminant, and that then the cutting speed is very high, with a decrease in the signal emitted by the contaminant gas providing information that the leading edge of the cut is tending to become perpendicular to the surface of the workpiece being processed, and that so the cutting speed is very low.
    [0018] [018] More specifically, the control method according to the invention monitors the emission line at 777 nm. This wavelength includes a strong emission from ionized oxygen, which can be easily detected even when oxygen is present only as a contaminating gas in the process, and more specifically provides the information required to control both laser perforation in preparation for the cut as for laser cutting. In the case of a laser drilling process under oxidizing conditions, with the use of oxygen as the auxiliary gas, this wavelength provides very sensitive anticipation on the ramp in increasing the amount of ionized oxygen in the process volume, a ramp that announces a explosion. In the case of a fusion laser drilling process, with the use of nitrogen as the auxiliary gas, this wavelength provides very sensitive information about the presence of a still closed volume that is being melted before opening. In the case of a laser cutting process, regardless of whether it is performed under oxidizing conditions or whether it is a fusion laser cutting process, this wavelength represents a rich source of information, as it provides both anticipation the risk of explosion as to the lateral diffusion of the oxidation process, resulting in a reduction in the final quality of the cut, and an anticipation of the phenomenon of closure of the incision, and the associated loss of the cut, regardless of the reasons upstream that led to the closure.
    [0019] [019] The monitoring of the signal emitted by a gas present in the volume of material involved by the laser cutting process then allows obtaining information on the state of the process and, therefore, controlling the process by adjusting the process mentioned above and the control parameters.
    [0020] - uma fonte de laser, que pode indiferentemente ser do tipo CO2 ou do tipo estado sólido (Nd:YAG, laser de fibra, laser de disco, laser de diodo); - uma cabeça de laser compreendendo um dispositivo de focagem para focar o feixe de laser gerado pela fonte de laser e um injetor para o fornecimento do gás auxiliar; - um curso óptico para transportar o feixe de laser gerado pela fonte de laser para o dispositivo de focagem da cabeça de laser; - um dispositivo de acionamento para mover a cabeça de laser e a peça de trabalho, uma em relação a outra, com uma velocidade ajustável, assim como para controlar a pressão do gás auxiliar, para ajustar a distância do injetor a partir da superfície da peça de trabalho e para ajustar a posição do ponto focal do feixe de laser em relação à superfície da peça de trabalho; e - um dispositivo de controle do processo, que compreende meios sensores para detectar pelo menos uma banda de comprimento de onda predeterminada da radiação emitida por um dado gás presente no volume de material irradiado pelo feixe de laser focado, meios de processamento de sinal para processar o sinal detectado pelos meios sensores, e meios de controle para controlar, com a base no sinal recebido pelos meios de processamento de sinal, a fonte de laser e/ou o dispositivo de acionamento para ajustar pelo menos um dos seguintes parâmetros de controle do processo: a potência do laser, a frequência e o ciclo de trabalho do pulso do laser, a pressão do gás auxiliar, a velocidade relativa da cabeça de laser com relação à peça de trabalho, a distância entre o injetor da cabeça de laser e a superfície da peça de trabalho, e a distância entre o ponto focal do feixe de laser e a superfície da peça de trabalho. [020] Regarding the laser cutting system implementing the control method according to the invention, it basically comprises: - a laser source, which can be either CO2 type or solid state type (Nd: YAG, fiber laser, disk laser, diode laser); - a laser head comprising a focusing device for focusing the laser beam generated by the laser source and an injector for supplying the auxiliary gas; - an optical path to transport the laser beam generated by the laser source to the laser head focusing device; - an actuating device for moving the laser head and the workpiece, relative to each other, with an adjustable speed, as well as for controlling the pressure of the auxiliary gas, to adjust the distance of the injector from the workpiece surface and to adjust the position of the laser beam focal point in relation to the workpiece surface; and - a process control device, comprising sensing means for detecting at least one band of predetermined wavelength of the radiation emitted by a given gas present in the volume of material irradiated by the focused laser beam, means of signal processing to process the signal detected by the sensor means, and control means to control, based on the signal received by the signal processing means, the laser source and / or the drive device to adjust at least one of the following process control parameters: the laser power, the frequency and duty cycle of the laser pulse, the pressure of the auxiliary gas, the relative speed of the laser head with respect to the workpiece, the distance between the laser head injector and the surface of the laser workpiece, and the distance between the focal point of the laser beam and the surface of the workpiece.
    [0021] [021] According to one embodiment, the sensing means comprises a photodiode to detect the band (s) of predetermined wavelength, a reflector / deflector device arranged to direct the radiation emitted by the laser cutting process to the photodiode and a optical filter device interposed between the photodiode and the reflector / deflector device to select the band (s) of predetermined wavelength.
    [0022] [022] According to one embodiment, the sensing means comprise several photodiodes to detect the band (s) of predetermined wavelength, several corresponding reflector / deflector devices to direct the radiation emitted by the laser cutting process to a respective photodiode and several corresponding optical filter devices interposed between a respective photodiode and a respective reflector / deflector device to select the band (s) of predetermined wavelength.
    [0023] [023] Regardless of the number of photodiodes, reflector / deflector devices and optical filter devices used as sensing media, the optical filter device can work on transmission and reflection. In this second case, the optical filter device can coincide with the reflector / deflector device arranged to direct the radiation emitted by the laser cutting process to the photodiode. The sensing means can be placed indifferently above or below the laser head focusing device.
    [0024] [024] In the case of a solid state laser source (Nd: YAG, fiber laser, disk laser, diode laser), the optical path comprises a transport fiber and the laser head further comprises a collimation, which is connected to the final end of the transport fiber and comprises one or more collimation lenses.
    [0025] [025] In this case, the reflector / deflector device may comprise, between the collimation device and the focusing device, a 90 degree deflector arranged to reflect at least 99.9% of the laser radiation and to transmit the radiation instead in the predetermined wavelength band (s). In that case, preferably, the sensing means further comprise a focusing lens disposed between the deflector and the photodiode to focus the detected signal on the photodiode. Furthermore, the optical filter device is preferably arranged between the deflector and the focusing lens and comprises a first optical filter arranged to reduce laser radiation and a second optical filter arranged to select the band (s) of predetermined wavelength. This also applies where multiple photodiodes, reflector / baffle devices and optical filter devices are provided, in which case each reflector / baffle device will comprise a respective baffle and a respective focusing lens will be provided between each baffle and the respective photodiode.
    [0026] [026] As an alternative to a 90 degree deflector, a branching device can be provided, which is arranged along the optical path and is configured to allow the laser beam generated by the laser source to be fully transported to the laser head through the transport fiber and the radiation that is emitted by the laser cutting process and is transported through the transport fiber is directed to the photodiode.
    [0027] [027] According to one embodiment, the branching device is integrated into an optical coupling device by means of which the laser generated by the laser source is launched on the transport fiber and comprises, in particular, a beam splitter disposed between a collimation lens and a focusing and launching lens of the optical coupling device in order to allow the laser beam generated by the laser source to pass completely through the focusing and launching lens and the radiation that is emitted by the process laser cut and be transported through the transport fiber to be directed to the photodiode.
    [0028] [028] According to one embodiment, the branching device comprises a secondary fiber welded to the transport fiber. In the event that an optical coupling device is provided, whereby the laser generated by the laser source is launched on the transport fiber, the secondary fiber is welded to the transport fiber at a point of the latter, which is positioned downstream of the optical coupling device. Alternatively, the optical coupling device can be emitted and the secondary fiber can be welded at the same point as the transport fiber is soldered to the laser source. In that case, it is particularly advantageous if the secondary fiber is soldered to an optical combiner to which the various fibers are soldered, fibers that are connected to a respective laser module that forms part of the laser source and is capable of emitting a laser beam. independently of the other laser modules. Brief Description of Drawings
    [0029] [029] Additional features and advantages of the invention will become more evident from the following detailed description, which is given purely by way of non-limiting example with respect to the attached drawings, in which: FIG. 1 schematically shows the volume of material involved by a laser drilling process.
    [0030] [030] FIGS. 2 and 3 show schematically the volume of material involved by a laser cutting process.
    [0031] [031] FIG. 4 schematically shows a process control device for a laser cutting system according to the invention.
    [0032] [032] FIGS. 5A and 5B are a top view and a sectional view, respectively, of a set of deflectors and photodiodes forming part of the sensing means of a process control device such as that of FIG. 4.
    [0033] [033] FIGS. 6 to 11 show schematically each respective modality variant of the sensor devices that can be used in the process control device for a laser cutting system according to the invention. Detailed Description of the Invention
    [0034] - uma fonte de laser (10), que pode ser indiferentemente do tipo CO2 ou do tipo estado sólido (Nd:YAG, laser de fibra, laser de disco, laser de diodo); - uma cabeça de laser que é geralmente indicada por 12 e compreende um dispositivo de focagem 14 para focar o feixe de laser gerado pela fonte de laser 10 e um injetor 16 para fornecer um gás auxiliar (que pode indiferentemente ser um gás inerte, tal como, por exemplo, nitrogênio, ou um gás reativo, tal como, por exemplo, oxigênio), o injetor 16 tem um furo de saída preferencialmente de seção transversal circular; - um curso óptico (não ilustrado, mas do tipo conhecido) disposto para transportar o feixe de laser gerado pela fonte de laser 10 para dispositivo de focagem 14 da cabeça de laser 12, onde o curso óptico pode ser formado ou por um conjunto de espelhos ou por uma fibra de transporte; - um dispositivo de acionamento (não ilustrado, mas do tipo conhecido) disposto para mover a cabeça de laser 12 e a peça de trabalho, uma em relação a outra, com uma velocidade relativa ajustável, bem como para controlar a pressão do gás auxiliar, para ajustar a distância do injetor 16 da superfície da peça de trabalho e para ajustar a posição do ponto focal F do feixe de laser em relação à superfície da peça de trabalho sendo processada, o dispositivo de acionamento é controlado por um controle numérico 18; e - um dispositivo de controle do processo disposto para controlar a fonte de laser 10 e/ou o dispositivo de acionamento (através do controle numérico 18) de modo a ajustar pelo menos um dos seguintes parâmetros de controle do processo: a potência do laser, a frequência e o ciclo de trabalho do pulso do laser, a pressão do gás auxiliar, a velocidade relativa da cabeça de laser 12 com relação à peça de trabalho, a distância entre o injetor 16 e a superfície da peça de trabalho, e a distância entre o ponto focal F do feixe de laser e a superfície da peça de trabalho sendo processada. [034] With respect first to the schematic illustration of FIG. 4, a laser cutting system according to the invention basically comprises: - a laser source (10), which can be either CO2 type or solid state type (Nd: YAG, fiber laser, disk laser, diode laser); - a laser head which is generally indicated by 12 and comprises a focusing device 14 for focusing the laser beam generated by the laser source 10 and an injector 16 for supplying an auxiliary gas (which can be an inert gas regardless, such as , for example, nitrogen, or a reactive gas, such as, for example, oxygen), the injector 16 has an outlet hole preferably of circular cross section; - an optical path (not shown, but of the known type) arranged to carry the laser beam generated by the laser source 10 to focusing device 14 of the laser head 12, where the optical path can be formed or by a set of mirrors or by a transport fiber; - a drive device (not shown, but of the known type) arranged to move the laser head 12 and the workpiece, relative to each other, with an adjustable relative speed, as well as to control the pressure of the auxiliary gas, to adjust the distance of the injector 16 from the workpiece surface and to adjust the position of the focal point F of the laser beam in relation to the surface of the workpiece being processed, the drive device is controlled by a numerical control 18; and - a process control device arranged to control the laser source 10 and / or the drive device (via numerical control 18) in order to adjust at least one of the following process control parameters: the laser power, the frequency and duty cycle of the laser pulse, the pressure of the auxiliary gas, the relative speed of the laser head 12 with respect to the workpiece, the distance between the injector 16 and the workpiece surface, and the distance between the focal point F of the laser beam and the surface of the workpiece being processed.
    [0035] [035] More specifically, the process control device comprises sensing means to detect at least one band of predetermined wavelength of the radiation emitted by a given gas present in the volume of material involved in the irradiation of the focused laser beam (hereinafter indicated , to facilitate, as a process volume), signal processing means to process the signal detected by the sensing means, and control means to control, based on the signal received by the signal processing means, the laser source and / or the drive device to adjust at least one of the process control parameters mentioned above.
    [0036] [036] The sensing means comprises a photodiode 20 to detect, preferably with a dynamic range of at least a decade, the band (s) of predetermined wavelength, a reflector / deflector device 22 arranged to direct the radiation to photodiode 20 emitted by the process volume and an optical filter device 24 interposed between the photodiode 20 and the reflector / deflector 22 to select the predetermined wavelength band (s). The optical filter device 24 can work on transmission or reflection. In this second case, the optical filter device 24 can coincide with the reflector / deflector device 22. The radiation emitted by the process volume is then directed by the reflector / deflector device 22, through the optical filter device 24, to the photodiode 20, that detects the band (s) of predetermined wavelength. As shown in FIGs. 5A and 5B, the sensing means comprise several photodiodes 20 (in the illustrated example, four photodiodes), as well as several corresponding reflector / deflector devices 22 and optical filter devices 24, arranged in such a way that each reflector / deflector 22 directs to a respective photodiode 20, through a respective optical filter device 24, the radiation emitted by the process volume in a given angular range. The sensing means can be positioned indifferently above or below the focusing device 14 of the laser head 12.
    [0037] [037] The signal processing device comprises a signal amplification and filtering circuit board 26, which is, for example, directly connected to photodiode 20, and a signal acquisition circuit board 28 connected to the signal circuit board. filtering and amplifying signal 26 to acquire the signal coming from the latter.
    [0038] [038] The control means comprise an electronic control unit 30 (for example, an industrial PC) in which a control software that is installed runs a control algorithm described in detail below. The electronic control unit 30 is connected on the one hand to the signal acquisition circuit board 28 and on the other hand, via a communication line with input and output interface, both to the laser source 10 and to the numerical control 18, so as to be able to directly control the laser source 10 to adjust the laser power, frequency and duty cycle, and indirectly, through numerical control 18, the drive device to adjust the remaining process control parameters mentioned above, that is, the relative speed, the auxiliary gas pressure, the distance of the injector from the material and the position of the focal point in relation to the material.
    [0039] [039] The process control parameters mentioned above are adjusted based on the signal in relation to the predetermined wavelength band (s) detected by the sensing means. According to the invention, as the predetermined wavelength band, a wavelength band selected in such a way as to include at least one gas emission line as an emitting element present in the process volume is used. The emission lines monitored for the purposes of process control are detected with a bandwidth not greater than 100 nm. Preferably, the gas used as the emitting element is oxygen or nitrogen.
    [0040] [040] The radiation emitted by oxygen has emission lines at the following wavelengths (in nm): 948, 845, 823, 795 and 777. The control method according to the invention comprises monitoring the last emission line mentioned above , and then acquire the signal at 777 nm, with a bandpass equal to ± 50 nm. As already determined in the introductory part of the description, this wavelength comprises a strong emission by ionized oxygen, which can be easily detected even when oxygen is only present as a contaminant in the process, and specifically provides the information required to control laser cutting , as well as controlling the drilling operation in preparation for the cut. This wavelength is used according to the invention on the one hand as information on the tendency for the amount of ionized oxygen in the process volume to increase, a trend that generally anticipates an explosion of drilling or cutting, and on the other hand, as a index of the amount of contaminant collected, and then as an index of perforation not yet completed or of a tendency to close the incision.
    [0041] [041] As nitrogen is considered, the radiation emitted by this gas has emission lines at the following wavelengths (in nm): 1358, 1246, 939, 870, 860, 745 and 576.
    [0042] a) Primeiro de tudo, a presença do material no qual se deseja fazer o furo é verificada. Com esse propósito, um primeiro trem de pulsos de laser é enviado para o material por meio da cabeça de laser e o sinal com relação à banda(s) de comprimento de onda predeterminada é detectado pelos meios sensores. Se o sinal detectado for muito baixo com relação a um limite predeterminado, essa informação é interpretada pelos meios de controle como indicando a ausência do material ou como indicando que o furo já foi feito antes. b) Uma vez que a presença do material foi confirmada, o processo de corte a laser é iniciado com valores adequados dos parâmetros de controle de processo indicados acima. Em particular, a fonte de laser está ligada por um certo intervalo de tempo predeterminado, no fim do qual a fonte de laser é desligada. Especificamente, se o processo acontece em um ambiente rico em oxigênio (usado como gás auxiliar), então o intervalo de tempo durante o qual a fonte de laser está ligada varia na faixa de 0,5 a 5 ms (preferencialmente 1 ms). Se, ao contrário, o oxigênio estiver presente somente como gás contaminante, então o intervalo de tempo durante o qual a fonte de laser está ligada varia na faixa de 0,5 a 100 ms (preferencialmente 50 ms). c) Após um certo tempo (tempo de relaxamento) a partir do desligamento da fonte de laser, a radiação emitida na banda(s) de comprimento de onda predeterminada é detectada pelos meios sensores e é certamente monitorada. Se o sinal detectado cai abaixo de um dado limite de reignição, então a etapa (b) é repetida, isto é, a fonte de laser é ligada novamente. Durante o monitoramento do sinal de controle, os meios de controle podem também medir a derivada no tempo desse sinal e usar essa derivada como uma indicação da robustez do procedimento de ajuste. [042] In order to perform laser drilling in preparation for cutting, an example of a control algorithm that can be used by the control means of the laser cutting system to adjust the process control parameters comprises the steps described below. a) First of all, the presence of the material in which the hole is to be drilled is checked. For this purpose, a first train of laser pulses is sent to the material by means of the laser head and the signal with respect to the band (s) of predetermined wavelength is detected by the sensing means. If the detected signal is too low with respect to a predetermined limit, this information is interpreted by the control means as indicating the absence of the material or as indicating that the hole has already been drilled. b) Once the presence of the material has been confirmed, the laser cutting process is started with adequate values of the process control parameters indicated above. In particular, the laser source is switched on for a predetermined period of time, at the end of which the laser source is switched off. Specifically, if the process takes place in an oxygen-rich environment (used as an auxiliary gas), then the time interval during which the laser source is turned on varies in the range of 0.5 to 5 ms (preferably 1 ms). If, on the contrary, oxygen is present only as a contaminating gas, then the time interval during which the laser source is switched varies in the range of 0.5 to 100 ms (preferably 50 ms). c) After a certain time (relaxation time) after the laser source is turned off, the radiation emitted in the band (s) of predetermined wavelength is detected by the sensing means and is certainly monitored. If the detected signal falls below a given re-ignition limit, then step (b) is repeated, that is, the laser source is switched on again. During the monitoring of the control signal, the control means can also measure the time derivative of that signal and use this derivative as an indication of the robustness of the adjustment procedure.
    [0043] [043] The process ends when the detected signal falls below a given end-of-process limit. Preferably, end-of-process control is performed at the time interval during which the laser source is turned on.
    [0044] [044] The values of the re-ignition and end-of-process limits depend on the material and the thickness of the workpiece. Preferably, these values are not fixed, but are dynamically altered by the control means in case the latter establish, based on the measured time derivative of the control signal, that the process is not very robust.
    [0045] a’) Primeiro de tudo, os parâmetros de controle de processo são ajustados para esses valores que são geralmente escolhidos dependendo da fonte de laser usada, bem como do material e da espessura da peça de trabalho. b’) Os meios sensores detectam o sinal correspondente à banda(s) de comprimento de onda predeterminada da radiação emitida pelo volume de processo. No caso de pelo menos um dos sinais monitorados superar um dado limite, os meios de controle interpretam esse excesso de emissão ou como fechamento parcial da incisão no caso de corte com um gás inerte ou como perda incipiente de controle do processo reativo no caso de corte com um gás reativo, e em qualquer caso, eles variam adequadamente pelo menos um dos parâmetros de controle de processo indicados acima, privilegiando, se possível, a potência do laser e a velocidade relativa. No caso de pelo menos um dos sinais monitorados cair abaixo de um dado limite, os meios de controle interpretam essa redução de emissão como um processo muito lento e variam adequadamente pelo menos um dos parâmetros de controle de processo indicados acima, privilegiando, se possível, a potência do laser e a velocidade relativa. [045] In order to perform a laser cutting operation, an example of a control algorithm that can be used by the control means of the laser cutting system to adjust the process control parameters comprises the steps described below. a ') First of all, the process control parameters are set to these values which are generally chosen depending on the laser source used, as well as the material and thickness of the workpiece. b ') The sensing means detect the signal corresponding to the band (s) of predetermined wavelength of radiation emitted by the process volume. In the event that at least one of the monitored signals exceeds a given limit, the control means interpret this excess emission either as partial closure of the incision in the case of cutting with an inert gas or as incipient loss of control of the reactive process in the case of cutting with a reactive gas, and in any case, they adequately vary at least one of the process control parameters indicated above, prioritizing, if possible, the laser power and the relative speed. In the event that at least one of the monitored signals falls below a certain limit, the control means interpret this emission reduction as a very slow process and vary appropriately at least one of the process control parameters indicated above, favoring, if possible, the laser power and the relative speed.
    [0046] [046] Furthermore, if the sensing means of the work system comprise a number of photodiodes arranged in such a way as to maintain a space correlation with that part of the process volume that generates the radiation detected by each of the photodiodes, then preferably the means of control correlate the detected signal with the cutting direction, thus making it possible to obtain information on the behavior anisotropy in all permitted cutting directions. Such information provides a measure of the displacement of the laser beam with respect to the center of the laser head injector, that is, with respect to the direction of the outflow of the auxiliary gas, and then allows to properly move the center of mass of the focusing lens or the injector.
    [0047] [047] Naturally, control algorithms other than those described above can be implemented within the scope of the present invention, subject to the principle of adjusting at least one of the process control parameters mentioned above based on the signal with respect to the radiation emitted by the volume process in at least one band of predetermined wavelength, such as the band of predetermined wavelength including at least one emission line of a gas or other emitting element present in the process volume during laser cutting.
    [0048] [048] With respect to FIGs. 6 to 11, for components identical or corresponding to those of FIGs. 4 and 5 are given the same reference numbers, some possible modalities of the sensing means that can be used in the process control device of a laser cutting system according to the invention will now be described.
    [0049] [049] In the embodiment of FIG. 6, the laser cutting system comprises a solid state laser source (not shown) (Nd: YAG, fiber laser, disk laser, diode laser), in which case the optical path comprises a transport fiber 32 and the laser head 12 further comprises a collimation device 34, which is connected to the final end of the transport fiber 32 and comprises one or more collimation lenses. Also in this case, the sensing means (photodiode 20, reflecting / deflecting device 22 and optical filtering device 24) can be placed above or below the focusing device 14. In the first case, the sensing means will be placed between the focusing device 14 and the collimation device 34, as shown in FIG. 6.
    [0050] [050] According to the embodiment of FIG. 7, which also refers to the case of a laser cutting system using a solid state laser source, the reflector / deflector 22 is formed by a 90 degree deflector, which is placed between the collimation device 34 and the focusing device 14 and is configured to reflect at least 99.9% of the laser radiation and to transmit, instead, the radiation band (s) of predetermined wavelength. In the proposed example, the sensing means further comprise a focusing lens 36 disposed between the baffle 22 and the photodiode 20 to focus the detected signal on the latter. Furthermore, in the proposed example, the optical filter device 24 is disposed between the baffle 22 and the focusing lens 36 and comprises, in the order of the baffle 22 to the focusing lens 36, a first optical filter 38 arranged to reduce laser radiation and a second optical filter 40 arranged to select the band (s) of predetermined wavelength. The same configuration of the sensing means can also be achieved with several photodiodes, reflecting / deflecting devices and optical filtering devices, in which case each reflecting / deflecting device will comprise a respective deflector and a respective focusing lens will be provided between each deflector and the respective deflector. photodiode.
    [0051] [051] In accordance with the modalities of FIGs. 8 to 11, which also refer to the case of a laser cutting system using a solid state laser source, instead of a 90 degree deflector, a branching device arranged along the optical path and configured to allow the laser beam generated by the laser source to be fully transported to the laser head via the transport fiber and to the radiation that is emitted by the process volume and is transported through the transport fiber to be directed to the photodiode.
    [0052] [052] More specifically, according to the embodiment of FIG. 8, an optical coupling device 42 is provided along the optical path, whereby the laser generated by the laser source is launched on the transport fiber 32, the optical coupling device 42 comprising a collimating lens 44 and a focusing and launching lens 46. In that case, the branching device is integrated into the optical coupling device 42 and comprises a beam splitter 48 disposed between the collimating lens 44 and the focusing and launching lens 46, in order to allow the laser beam generated by the laser source to pass completely through the focusing and launching lens 46, and the radiation that is emitted by the process volume and is transported by the transport fiber 32 to be directed to the photodiode 20. As in the embodiment of FIG. 7, the sensing means further comprises a focusing lens 36 disposed between the beam splitter 48 and the photodiode 20 to focus the detected signal thereon. Furthermore, also in the case where the optical filter device 24 is disposed between the beam divider 48 and the focusing lens 36 and comprises a first optical filter 38 arranged to reduce laser radiation and a second optical filter 40 arranged to select the band (s) of predetermined wavelength.
    [0053] [053] In the modalities of FIGs. 9 to 11, in contrast, the branching device comprises a secondary fiber 50 welded to the transport fiber 32.
    [0054] [054] More specifically, according to the embodiment of FIG. 9, in which the optical path comprises an optical coupling device (not shown) by means of which the laser generated by the laser source is launched on the transport fiber, the secondary fiber 50 is welded to the transport fiber 32 at a point thereof last positioned downstream of the optical coupling device. Also in that case, the sensing means comprise, in addition to the secondary fiber 50, a collimation lens 52, an optical filter device 24, a focusing lens 36 and a photodiode 20, the optical filter device 24 comprises, for example, in turn, a first optical filter 38 arranged to reduce laser radiation and a second optical filter 40 arranged to select the band (s) of predetermined wavelength.
    [0055] [055] According to the embodiment of FIG. 10, the optical coupling device along the optical path is omitted and the secondary fiber 50 is welded to the transport fiber 32 at the same point from which the transport fiber is welded to an output fiber 54 of the laser source. Insofar as the sensing means are considered, which was determined above with respect to FIG. 9 still applies.
    [0056] [056] Finally, according to the embodiment of FIG. 11, the laser source 10 comprises a plurality of laser modules (10.1, 10.2, ..., 10.N) capable of emitting a laser beam independently of one another, and a corresponding plurality of output fibers ( 54.1, 54.2, ..., 54.N) extending from a respective laser module. The output fibers are connected on the input side to an optical combiner 56, to which the transport fiber 32 is connected on the output side. In that case, the secondary fiber 50 is welded to the optical combiner 56. As the sensing means are considered, what has been determined with respect to FIG. 9 still applies.
    [0057] [057] Naturally, the principle of the invention remains unchanged, the ways to carry out the control method and the modalities of the laser cutting system can vary greatly from those described and illustrated purely by means of a non-limiting example.
    权利要求:
    Claims (12)
    [0001]
    A method for controlling a laser cutting process, the process provides irradiation to a workpiece (P) through a laser beam that is generated by a laser source (10) and focused by a laser head (12) , as well as providing a flow of an auxiliary gas through an injector (16) of the laser head (12), the control method, CHARACTERIZED by the fact that it comprises the steps of: a) detecting the radiation wavelength signal emitted by an emitting element present in the volume of material irradiated by the focused laser beam, and b) adjust, based on the detected signal, at least one of the following process control parameters: the laser power, the frequency and the duty cycle of the laser pulse, the pressure of the auxiliary gas, the relative speed of the laser (12) with respect to the workpiece (P), the distance from the laser head injector (12) from the surface (S) of the workpiece (P), and the distance from the focal point (F) of the laser beam from the workpiece surface (S) (P), wherein step (a) is performed by detecting the radiation emitted in at least one band of predetermined wavelength, which includes the wavelength at 777 nm and has a bandwidth not greater than 100 nm, and wherein the auxiliary gas or a contaminant gas present in the volume of material irradiated by the focused laser beam is used as the emitting element.
    [0002]
    Method, according to claim 1, CHARACTERIZED by the fact that in order to perform a drilling operation in the preparation of the cut, said step (b) comprises the following substeps: b1) connect the laser source (10) for a first predetermined time interval in the range of 0.5 to 5 ms in the case of oxygen being used as an auxiliary gas, and in the range of 0.5 to 100 ms in the case of a gas other than oxygen is used as an auxiliary gas; b2) switching off the laser source (10) at the end of said first predetermined time interval; and b3) wait until the detected wavelength signal becomes less than a given limit value, and only then repeat the substeps (b1) and (b2).
    [0003]
    Method according to claim 1 or 2, CHARACTERIZED by the fact that step (b) is performed in such a way that if the wavelength signal detected in step (a) exceeds a given limit, this is interpreted as a partial closure of the incision in the case of cutting with an inert gas, or as the beginning of a loss of control of the reactive process in the case of cutting with a reactive gas, and at least one of the process control parameters mentioned above is varied accordingly, whereas if the wavelength signal detected in step (a) becomes below a given limit, this is interpreted as meaning that the process is very slow, and at least one of the process control parameters mentioned above is varied accordingly.
    [0004]
    Laser cutting device, CHARACTERIZED by the fact that it comprises: - a laser source (10); - a laser head (12) comprising a focusing device (14) to focus the laser beam generated by the laser source (10) on a workpiece (P) and an injector (16) to supply an auxiliary gas ; - an optical path for transporting the laser beam generated by the laser source (10) to the focusing device (14) of the laser head (12); - an actuating device for moving the laser head (12) and the workpiece (P), relative to each other, with an adjustable speed, as well as for controlling the pressure of the auxiliary gas, to adjust the distance of the injector (16) from the surface (S) of the workpiece (P) and to adjust the position of the focal point (F) of the laser beam in relation to the surface (S) of the workpiece (P); and - a process control device, comprising sensor means adapted to detect at least one band of predetermined wavelength of the radiation emitted by the auxiliary gas or by a contaminating gas present in the volume of material irradiated by the focused laser beam, processing means signal to process the signal detected by said sensor means, and control means to control, based on the signal received by said signal processing means, the laser source (10) and / or the drive device to adjust at least one of the following process control parameters: the laser power, the frequency and duty cycle of the laser pulse, the auxiliary gas pressure, the relative speed of the laser head (12) with respect to the workpiece (P ), the distance of the laser head injector (12) from the surface (S) of the workpiece (P), and the distance from the focal point (F) of the laser beam from the surface (S) of the workpiece of work son (P), wherein said predetermined wavelength band includes the wavelength at 777 nm and has a bandwidth not greater than 100 nm.
    [0005]
    Apparatus according to claim 4, CHARACTERIZED by the fact that said sensing means comprise a photodiode (20) to detect at least one predetermined wavelength band, a reflector / deflector device (22) arranged to direct the radiation emitted by the volume of material irradiated by the laser beam focused on the photodiode (20), and an optical filter device (24) interposed between the photodiode (20) and the reflector / deflector device (22) to select at least one said band predetermined wavelength.
    [0006]
    Apparatus according to claim 5, CHARACTERIZED by the fact that the laser source (10) is a solid state laser source, in which the optical path comprises a transport fiber (32), in which the laser head (12) comprises a collimation device (34) connected to the final end of the transport fiber (32), and in which the reflector / deflector device (22) is a 90 degree deflector arranged to reflect at least 99.9% of the laser radiation and to transmit the radiation emitted in at least said band of predetermined wavelength.
    [0007]
    Apparatus according to claim 6, CHARACTERIZED by the fact that said sensing means additionally comprise a focusing lens (36) disposed between the reflector / deflector device (22) and the photodiode (20) to focus on the latter radiation emitted in at least one predetermined wavelength band, and in which the optical filter device (24) is disposed between the reflector / deflector device (22) and the focusing lens (36) and comprises a first optical filter ( 38) arranged to reduce laser radiation and a second optical filter (40) arranged to select at least one predetermined wavelength band.
    [0008]
    Apparatus according to claim 4, CHARACTERIZED by the fact that the laser source (10) is a solid state laser source, in which the optical path comprises a transport fiber (32) and in which said sensing means comprise a photodiode (20) for detecting at least one band of predetermined wavelength, a branching device (48, 50) arranged along the optical path (32) and configured to allow the laser beam generated by the source of laser (10) is fully transported to the laser head (12) via the transport fiber (32) and the radiation that is emitted by the laser cutting process and is transported through the transport fiber (32) to be directed to the photodiode (20), and an optical filter device (24) interposed between the photodiode (20) and the branching device (48, 50) to select at least one band of predetermined wavelength.
    [0009]
    Apparatus according to claim 8, CHARACTERIZED by the fact that the optical path comprises an optical coupling device (42) comprising a collimation lens (44) and a focusing and launching lens (46), and in which the branching device (48, 50) comprises a beam splitter (48) disposed between the collimation lens (44) and the focusing and launching lens (46), in order to allow the laser beam generated by the source laser (10) passes completely through the focusing and launching lens (46), and the radiation that is emitted by the laser cutting process and is carried by the transport fiber (32) to be directed to the photodiode (20) .
    [0010]
    Apparatus according to claim 8, CHARACTERIZED by the fact that the optical path comprises an optical coupling device and in which the branching device (48, 50) comprises a secondary fiber (50) welded to the transport fiber (32) at a point of the latter that is positioned downstream of the optical coupling device.
    [0011]
    Apparatus according to claim 8, CHARACTERIZED by the fact that the transport fiber (32) is welded to an output fiber (54) of the laser source (10) and in which the branching device (48, 50) it comprises a secondary fiber (50), which is welded to the transport fiber (32), at the same point where it is welded to the outlet fiber (54).
    [0012]
    Apparatus according to claim 8, CHARACTERIZED by the fact that the laser source (10) comprises a plurality of laser modules (10.1, 10.2, ..., 10.N) capable of emitting a laser beam in a way independent of each other and a corresponding plurality of output fibers (54.1, 54.2, ..., 54.N) associated with each of the respective laser modules (10.1, 10.2, ..., 10.N), where the optical path comprises an optical combiner (56) to which the output fibers (54.1, 54.2, ..., 54.N) are connected on the input side and to which the transport fiber (32) is connected on the outlet, and where the branching device (48, 50) comprises a secondary fiber (50) welded to the optical combiner (56).
    类似技术:
    公开号 | 公开日 | 专利标题
    BR112013027102B1|2021-04-06|METHOD TO CONTROL A LASER CUTTING PROCESS AND LASER CUTTING EQUIPMENT
    EP3210712A1|2017-08-30|Direct diode laser processing device and output monitoring method for same
    KR20130101441A|2013-09-13|Laser cutting head and method for cutting a workpiece by means of a laser cutting head
    US9827045B2|2017-11-28|Laser waveguide device and laser waveguide system
    US20190084092A1|2019-03-21|Methods and apparatuses for controlling cutting processes
    JP5378874B2|2013-12-25|Laser soldering apparatus and laser soldering method
    KR100922159B1|2009-10-21|Apparatus and method for welding strips of spacer grid
    US20170304940A1|2017-10-26|Direct diode laser oscillator, direct diode laser processing apparatus, and reflected light detecting method
    KR100922160B1|2009-10-19|Laser welder enabling removal of distortion by hot-spot from the spacer grid image after laser welding
    WO2015118829A1|2015-08-13|Laser machining device
    JP6868796B2|2021-05-12|Laser device
    DK2709576T3|2018-05-28|METHOD OF CALIBRATING A SYSTEM FOR SURGICAL TREATMENT OF AN EYE
    US20160263700A1|2016-09-15|Welding mode determination device, method for determining welding mode, and laser beam welding device
    JP6725572B2|2020-07-22|Laser processing machine and laser processing method
    JP6824092B2|2021-02-03|Laser processing method and laser processing equipment
    KR101855744B1|2018-06-21|Realtime Temperature Control Laser System
    JP2019072736A|2019-05-16|Laser processing device and method therefor
    KR20180095188A|2018-08-27|Fiber laser systems with real-time laser output verification
    JPH05136510A|1993-06-01|Laser output controller
    同族专利:
    公开号 | 公开日
    ZA201307962B|2015-01-28|
    JP2014512273A|2014-05-22|
    KR102119190B1|2020-06-29|
    IL228866A|2017-04-30|
    AU2012245901A1|2013-11-28|
    CN103501956B|2015-11-25|
    RU2013151684A|2015-05-27|
    MX338115B|2016-04-01|
    CN103501956A|2014-01-08|
    KR20140021640A|2014-02-20|
    SG194548A1|2013-12-30|
    ITTO20110352A1|2012-10-22|
    MX2013012263A|2014-03-05|
    UA112079C2|2016-07-25|
    EP2699380B1|2016-07-27|
    RU2607502C2|2017-01-10|
    ES2609854T3|2017-04-24|
    PL2699380T3|2017-02-28|
    BR112013027102A2|2020-08-11|
    PT2699380T|2016-09-23|
    IL228866D0|2013-12-31|
    EP2699380B9|2016-11-23|
    CA2833835A1|2012-10-26|
    US8981258B2|2015-03-17|
    AU2012245901B2|2015-05-14|
    CA2833835C|2019-03-12|
    JP6063448B2|2017-01-18|
    WO2012143899A1|2012-10-26|
    HUE030593T2|2017-05-29|
    US20140034614A1|2014-02-06|
    EP2699380A1|2014-02-26|
    引用文献:
    公开号 | 申请日 | 公开日 | 申请人 | 专利标题
    JPS5451097A|1977-09-30|1979-04-21|Hitachi Ltd|Processing by laser|
    DE3926859C2|1988-12-30|1991-04-18|Fraunhofer-Gesellschaft Zur Foerderung Der Angewandten Forschung Ev, 8000 Muenchen, De|
    US5026979A|1990-03-05|1991-06-25|General Electric Company|Method and apparatus for optically monitoring laser materials processing|
    DE69114399T2|1990-08-07|1996-03-21|Amada Co|Device for determining the cutting state in laser beam processing.|
    US5204517A|1991-12-24|1993-04-20|Maxwell Laboratories, Inc.|Method and system for control of a material removal process using spectral emission discrimination|
    DE4331262C2|1993-09-15|1996-05-15|Wissner Rolf|Laser machine for machining a workpiece and method for controlling a laser machine|
    DE19607376C2|1996-02-27|1998-02-19|Thyssen Laser Technik Gmbh|Process for laser beam cutting of workpieces|
    JP2001138082A|1999-11-05|2001-05-22|Amada Co Ltd|Method and device for controlling laser beam cutting|
    NL1018403C1|2000-10-05|2002-04-08|Boschman Tech Bv|Method for cutting a composite structure with one or more electronic components using a laser.|
    DE10060407C2|2000-12-05|2003-04-30|Lpkf Laser & Electronics Ag|Device for laser beam drilling|
    JP3792683B2|2003-07-16|2006-07-05|ファナック株式会社|Laser welding equipment|
    JP4349075B2|2003-10-28|2009-10-21|パナソニック電工株式会社|Laser processing method and processing state judgment method|
    WO2007124765A1|2006-04-28|2007-11-08|Trumpf Werkzeugmaschinen Gmbh + Co. Kg|Laser machining device and method for laser machining|
    CN100475414C|2007-06-29|2009-04-08|华中科技大学|Real time monitoring device of the three-dimensional laser beam welding and incising process|
    JP5011072B2|2007-11-21|2012-08-29|株式会社ディスコ|Laser processing equipment|
    RU2375162C2|2007-11-30|2009-12-10|Игорь Владимирович Монаенков|Method for automatic control of laser cutting or hole drilling process and device for its realisation|
    JP2009194176A|2008-02-14|2009-08-27|Toshiba Corp|Solid laser device and laser machining method|
    WO2009137494A1|2008-05-05|2009-11-12|Applied Spectra, Inc.|Laser ablation apparatus and method|
    JP2010240689A|2009-04-06|2010-10-28|Miyachi Technos Corp|Laser beam machining method and laser beam machining apparatus|
    JP2010274278A|2009-05-27|2010-12-09|Nippon Sharyo Seizo Kaisha Ltd|Laser beam machine|
    JP5466910B2|2009-09-29|2014-04-09|芝浦メカトロニクス株式会社|Laser processing method and laser processing apparatus|
    US9061369B2|2009-11-03|2015-06-23|Applied Spectra, Inc.|Method for real-time optical diagnostics in laser ablation and laser processing of layered and structured materials|
    US8309883B2|2010-05-20|2012-11-13|Ipg Photonics Corporation|Methods and systems for laser processing of materials|
    RU98963U1|2010-06-03|2010-11-10|Общество с ограниченной ответственностью "Страж-Лазер" |DEVICE FOR LASER CUTTING OF SMALL-SIZED HOLES OF AN ARBITRARY FORM IN THICK SHEETS OF HIGH-REFLECTING METALS|
    WO2012005816A2|2010-06-30|2012-01-12|Resonetics Llc|Precision laser ablation|
    US9120181B2|2010-09-16|2015-09-01|Coherent, Inc.|Singulation of layered materials using selectively variable laser output|
    JP6261844B2|2012-02-20|2018-01-17|株式会社ディスコ|Laser processing method and laser processing apparatus|EP2409808A1|2010-07-22|2012-01-25|Bystronic Laser AG|Laser processing machine|
    EP2883647B1|2013-12-12|2019-05-29|Bystronic Laser AG|Method for configuring a laser machining device|
    CN104162582A|2014-07-21|2014-11-26|苏州璟瑜自动化科技有限公司|Punching device with laser hole cutting function|
    RU2578885C2|2014-08-21|2016-03-27|Федеральное государственное бюджетное образовательное учреждение высшего профессионального образования "Казанский национальный исследовательский технический университет им. А.Н. Туполева-КАИ" |Optical laser head|
    JP5965454B2|2014-10-14|2016-08-03|株式会社アマダホールディングス|Direct diode laser processing apparatus and sheet metal processing method using the same|
    CN105312781A|2014-12-08|2016-02-10|牛得草|Method for detecting whether materials are penetrated or not by using change of gas pressure or flow|
    WO2016181359A1|2015-05-13|2016-11-17|Bystronic Laser Ag|Laser-machining device|
    GB201604097D0|2016-03-09|2016-04-20|Spi Lasers Uk Ltd|Apparatus and method for controlling laser processing of a material|
    DE102016208264A1|2016-05-13|2017-11-16|Trumpf Werkzeugmaschinen Gmbh + Co. Kg|Method and device for monitoring, in particular for controlling, a cutting process|
    CN110290892B|2016-12-30|2021-09-28|依赛彼集团公司|Dynamic duty cycle for welding and cutting equipment|
    RU180185U1|2017-06-07|2018-06-06|Федеральное государственное бюджетное образовательное учреждение высшего образования "Казанский национальный исследовательский технический университет им. А.Н. Туполева-КАИ" |Laser optical head|
    JP6816071B2|2018-08-24|2021-01-20|ファナック株式会社|Laser processing system, jet observation device, laser processing method, and jet observation method|
    CN109530933B|2018-11-15|2020-11-10|无锡洲翔激光设备有限公司|Process for rapidly perforating and cutting small hole in thick plate|
    CN110014237B|2019-04-10|2020-11-10|无锡洲翔激光设备有限公司|Rapid punching process for medium-thickness stainless steel plate|
    CN110170749A|2019-05-22|2019-08-27|奔腾激光有限公司|A kind of ultrafast cutting technique of laser cutting machine|
    CN112077462A|2020-09-17|2020-12-15|伯纳激光科技有限公司|Laser perforation method applied to carbon steel|
    法律状态:
    2020-08-25| B06F| Objections, documents and/or translations needed after an examination request according [chapter 6.6 patent gazette]|
    2020-10-20| B06U| Preliminary requirement: requests with searches performed by other patent offices: procedure suspended [chapter 6.21 patent gazette]|
    2021-02-09| B09A| Decision: intention to grant [chapter 9.1 patent gazette]|
    2021-04-06| B16A| Patent or certificate of addition of invention granted [chapter 16.1 patent gazette]|Free format text: PRAZO DE VALIDADE: 20 (VINTE) ANOS CONTADOS A PARTIR DE 20/04/2012, OBSERVADAS AS CONDICOES LEGAIS. |
    优先权:
    申请号 | 申请日 | 专利标题
    IT000352A|ITTO20110352A1|2011-04-21|2011-04-21|METHOD FOR THE CONTROL OF A LASER CUTTING PROCESS AND LASER CUTTING SYSTEM IMPLEMENTING THIS METHOD|
    ITTO2011A000352|2011-04-21|
    PCT/IB2012/051992|WO2012143899A1|2011-04-21|2012-04-20|Method for controlling a laser cutting process and laser cutting system implementing the same|
    [返回顶部]